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Transforming busbar - メーカー・企業と業務用製品 | イプロスものづくり

Transforming busbarの製品一覧

1~2 件を表示 / 全 2 件

表示件数

[Busbar Concerns] I want to reduce the labor hours during assembly.

By converting the busbar into a circuit board, high insulation and compactness are achieved!

We have substrate-formed busbars used for high current applications. By utilizing our special technology for substrate formation, we achieve high insulation properties and compactness. We can accommodate lengths of up to 1,000mm. Additionally, substrate formation is expected to provide the following benefits: - Substrate mounting of power devices such as IGBTs and SiCs - Possible attachment to equipment after substrate mounting → Reduction of assembly labor and prevention of miswiring - Space-saving due to simplification of substrate and wiring → Miniaturization of the entire device - The greatest advantage of substrate formation is its high insulation performance and usability. The insulation layer made with prepreg has a consistent thickness, eliminating concerns about variations in thickness like those seen with powder coating. - Covering areas other than the necessary parts with a substrate makes handling easier and allows for safe operations during transport and installation. *For more details, please refer to the PDF document or feel free to contact us.

  • kyoei_A4_大電流基盤_1.png
  • Printed Circuit Board
  • Circuit board design and manufacturing
  • Transforming busbar

ブックマークに追加いたしました

ブックマーク一覧

ブックマークを削除いたしました

ブックマーク一覧

これ以上ブックマークできません

会員登録すると、ブックマークできる件数が増えて、ラベルをつけて整理することもできます

無料会員登録

[Busbar Concerns] I want to ensure the safety of workers in high current equipment.

By converting the busbar into a substrate, high insulation and miniaturization are achieved!

We have substrate-ized busbars used for high current applications. By utilizing our special technology for substrate-ization, we achieve high insulation properties and miniaturization. We can accommodate lengths of up to 1,000mm. Additionally, the substrate-ization is expected to provide the following benefits: - Substrate mounting of power devices such as IGBTs and SiCs - Possible attachment to devices after substrate mounting → Reduction of assembly labor and prevention of miswiring - Space-saving due to simplification of substrate and wiring → Overall miniaturization of the device - The greatest advantage of substrate-ization is its high insulation performance and usability. The insulation layer using prepreg has a consistent thickness, eliminating concerns about variations in thickness like those seen with powder coating. - By covering areas other than the necessary parts with the substrate, handling becomes easier, and operations during transport and installation can be performed safely. *For more details, please refer to the PDF document or feel free to contact us.

  • kyoei_A4_大電流基盤_1.png
  • Printed Circuit Board
  • Circuit board design and manufacturing
  • Transforming busbar

ブックマークに追加いたしました

ブックマーク一覧

ブックマークを削除いたしました

ブックマーク一覧

これ以上ブックマークできません

会員登録すると、ブックマークできる件数が増えて、ラベルをつけて整理することもできます

無料会員登録